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Bad connections caused by... |
Could be detected in tests as... |
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Open |
Intermittent Open |
High Resistance |
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| Wire not connected or missing: | X | ||
| Flux on mating surface of contact | X | X | X |
| Cold solder joint | X | X | X |
| Wire insulation caught in a crimp termination | X | X | X |
| Metal oxides on surface of joined metal parts including failure of gas tight connection | X | X | X |
| Deformed/damaged/worn contact: including fatigue in spring force of contact | X | X | X |
| Failure of contact to fully mate because contact is not retained in connector housing | X | X | X |
| Wrong wire gauge for termination | X | X | X |
| Loose crimps: including those caused by missing strands of wire | X | X | X |
| All strands broken: (sometimes the result of excessive crimp force) | X | X | X |
| Fixturing to the device under test has any of the problems above | X | X | X |
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