Bad insulation caused by... |
Could be detected* in test as... |
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|---|---|---|---|---|
| Short | Intermittent Short | IR Failure (leaking) | Dielectric Breakdown (arcing) | |
| Extraneous wire | ||||
| Mis-registration in IDC connectors (tines have destroyed insulation). | ||||
| Solder bridges | When a small air gap exists |
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| Wire insulation that has been damaged and pierced due to compression (cable ties, strain reliefs), heat (heat shrinking, soldering), or stripping (to inner conductors during outer jacket or shield removal). | When a small air gap exists |
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| Loose strands of wire outside of termination | ||||
| Loose metal particles such as metal flake or cut strand of wire | ||||
| Combination of leakage and arcing between layers of insulation | Partial Breakdown | |||
| Burn/carbon trail from breakdown; also some flux residue | Only with severe carbon trails | |||
| Ionic contamination like salt or RMA flux on connector body | ||||
| Hydroscopic plastics/insulators that absorb moisture in humidity | ||||
| Plywood and most phenolic materials (as often used in fixturing), but only if used as an insulator for connections. | ||||
| Fixturing to the device under test that has any of the problems above | ||||
